Wet Etch

Function & Features

  • Automatic chemical decapsulation equipment 
  • The functions of etching, heating, acetone cleaning, and drying available 
  • Protecting workers from harmful chemicals 
  • Minimizing damage etching of copper in the case of copper wired IC 
  • Minimizing the damage on the ball or the tape at the bottom of a package 
  • Fast, safe, and efficient decapsulation
  • Dual heating (MIS-specialized technology) 
  • More precise, faster, and safer decap possible. 
  • Repetitions made simple using recipe files 
  • Consumable gaskets are unnecessary and very small amount of etching chemical is used. 
  • Expanded decap possibility for various sizes and patterns of packages 
  • Minimal maintenance and repair costs, and long lifecycles
  • LED Chip Package Decap available