Function & Features

• Automatic laser decapsulation system 
• All types of semiconductor package can be removed 
• Any material(Au, Cu, Al) of wire part and 2nd bonding area   can be opened  
• Effective decapsulation solution for Cu wire chip : Minimize   the damage on Cu wire by chemical etching after laser   operation
• A few hundred microns of EMC on die surface can be   opened with chemical etching(by manual or MIS Wet Etch :   Minimal acid use) 
• Easy, simple, fast and safe operation
  • Vision camera provides real time image 
  • User can set the decap area by mouse drag / numerical value input 
  • User can see laser decapsulation process & result on monitor screen 
  • Superimposing X-ray image on real-time sample picture is available 
  • Auto door lock : System door is not opened during laser operation 
  • Automatic Z axis adjustment by PC program  
• User can observe the operation process through the window(protected from laser radiation) 
• Repetitions made simple using recipe files 
• Fume & Dust can be exhausted (Option: Fume & Dust collector)